Positioning wafers with micrometer precision for PECVD coating

For loading and unloading workpiece carriers containing wafers of different sizes in an automated process prior to PECVD coating, acp systems has developed a robotic solution aided by image processing for a leading manufacturer of space solar technology. It ensures that the specified positioning accuracy of +/- 0.1 mm in the nests of the workpiece carriers is met and that both the manufacturing tolerances of the carriers and their shrinkage caused by cooling during loading are compensated for.